Business ExpandingPebble Square Inc., Developer of Edge AI Semiconductors, Establishes Japanese Subsidiary in Tokyo

Oct 06, 2025

Pebble Square Inc.External site: a new window will open. is a fabless semiconductor company based in South Korea that develops AI chips capable of high-efficiency, low-power processing for voice, image, and video recognition and analysis. The company leverages a groundbreaking technology called Analog-PIM (Processing-in-Memory) to achieve this.

Establishment
2025/05
Destination
Tokyo
  • Digital & AI
  • Semiconductors, Robotics, and Machinery
  • Korea

Pebble Square Inc. possesses proprietary Analog-PIM (Processing-in-Memory) technology, which enables analog computation directly from flash memory embedded in AI semiconductor chips. By minimizing data transfer, this approach achieves both low power consumption and high-performance AI processing.

This innovative technology has attracted significant attention. Since its founding in 2021, the company has raised a total of 15 billion KRW in funding within South Korea.

In May 2025. the company established “Pebble Square Japan Co,Ltd.”, its subsidiary in Japan. The area around the University of Tokyo, where the company's CEO earned a doctoral degree, is surrounded by a vibrant ecosystem of AI startups originating from the university. By optimizing their advanced AI algorithms for Pebble Square’s proprietary chips, AI solutions that surpass existing technologies in both performance and energy efficiency are expected to be realized.

In conjunction with the establishment of its Japanese subsidiary, Pebble-Square Japan, Inc. JETRO’s Invest Japan Business Support Center (IBSC) provided consulting services related to company registration and labor-related procedures.

Pebble Square logo with a glowing AI chip illustration. The background shows electronic circuit patterns, with the text ‘where a new wave of innovation begins with AI chip’ displayed.
Blue glowing AI chip illustration in the center. On the right, text lists ‘On-Device AI Applications,’ ‘AI-driven Failure Analysis,’ and ‘High Performance AI chip,’ accompanied by futuristic images representing each feature.

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