Japanese Government Procurement
Inter-University Research Institute Corporation - Notice on the use of single tendering proceduresBump deposition process for HL-LHC ATLAS upgrade silicon pixel detector front-end ASIC wafers 1 set
This procurement is covered by the WTO Agreement on Government Procurement, Japan-EU Economic Partnership Agreement or Japan-UK Comprehensive Economic Partnership Agreement.
| Publishing date | Mar 26, 2025 |
|---|---|
| Type of notice | Notice on the use of single tendering procedures |
| Procurement entity | Inter-University Research Institute Corporation - Ibaraki |
| Classification |
0024 Professional/Scientific & Controlling Instruments & Apparatus |
| Summay of notice | ⑴ Classification of the products to be procured : 24 ⑵ Nature and quantity of the products to be manufacutured : Bump deposition process for HL-LHC ATLAS upgrade silicon pixel detector front-end ASIC wafers 1 set ⑶ Expected date of the contract award : 28 April, 2025 ⑷ Reasons for the use single tendering procedures as manufactured for in the Agreement on Government Procurement : d "Interchangeability" ⑸ Contact point for the notice : KUROI Munenori, Contracts Unit 1, Contracts Division, Financial Department, Inter-University Research Institute Corporation High Energy Accelerator Research Organization, 1-1 Oho Tsukuba-shi 305-0801 Japan, TEL 029-864-5164 |
