Japanese Government Procurement
National University Corporation - Notice on the use of single tendering proceduresFabrication of 55nmCMOS Silicon Base Wafer for MTJ/CMOS Hybrid Integrated Circuit 1 Set
This procurement is covered by the WTO Agreement on Government Procurement, Japan-EU Economic Partnership Agreement or Japan-UK Comprehensive Economic Partnership Agreement.
| Publishing date | Oct 28, 2019 |
|---|---|
| Type of notice | Notice on the use of single tendering procedures |
| Procurement entity | National University Corporation - Miyagi |
| Classification |
0101 Telecommunications Related Services |
| Summay of notice | ⑴ Classification of the products to be procured : 101 ⑵ Nature and quantity of the products to be manufactured : Fabrication of 55nmCMOS Silicon Base Wafer for MTJ/CMOS Hybrid Integrated Circuit 1 Set ⑶ Expected date of the contract award : 19 November, 2019 ⑷ Reasons for the use single tendering procedures as provided for in the Agreement on Government Procurement : b "Absence of Competition for Technical Reasons" ⑸ Contact point for the notice : Shigehiro Akiyama, Procurement Services Office, Finance Department, Tohoku University, 2-1-1 Katahira Aoba-ku Sendai-shi 980-8577 Japan, TEL 022-217-4869 |
