Online Trade Fair Database (J-messe)
27th ISP - IC & SENSOR PACKAGING EXPO
| Date | January 21, 2026 - January 23, 2026 |
|---|---|
| Location |
Tokyo
/
Japan
/
Asia
|
| Venue |
Tokyo Big Sight |
| Items to be exhibited | Assembly Equipment, Packaging Materials/Components, Analysis/Simulation Software for IC Packaging, Semiconductor Device Inspection Equipment, SATS/Contract Design Services, Plating/Etching Materials/Equipment, MEMS Device Manufacturing Equipment |
| For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
RX Japan Ltd.
Tel : +81-3-6739-4102 E-mail : inj.jp@rxglobal.com |
| Message from organizer |
Asia's leading exhibition for IC final manufacturing gathering advanced equipment, materials and services. All kinds of packaging technologies such as semiconductor assembly equipment, inspection equipment, packaging materials, plating and etching, etc. will be exhibited, making it an ideal show to expand sales channels to manufacturers of semiconductors, sensors, electronic components, electronic devices, automobiles, etc.
Held with concurrent exhibitions. |
| Industry |
|
| Frequency | Annual |
| last fair information |
2025 year Total number of visitors : 85430 Total number of exhibitors : 1711 The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | March 10, 2025 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
