Online Trade Fair Database (J-messe)
8th Adhesion & Bonding Expo Osaka
| Date | May 8, 2024 - May 10, 2024 |
|---|---|
| Location |
Osaka (Osaka)
/
Japan
/
Asia
|
| Venue |
INTEX Osaka |
| Items to be exhibited | Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools, etc. |
| For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
RX Japan Ltd.
Tel : +81-3-6739-4118 E-mail : mw-j.jp@rxglobal.com |
| Message from organizer |
The show gathers advanced adhesive and bonding technologies for automobile, electronics, construction, etc. It is held twice a year in Osaka and Tokyo.
Held with concurrent exhibitions. |
| Industry |
|
| Frequency | Annual |
| last fair information |
2023 year Total number of visitors : 23217 The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | March 28, 2024 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
