2023 Microelectronics Show

Date May 31, 2023 - June 1, 2023
Location Tokyo / Japan / Asia
Venue Tokyo Big Sight
Items to be exhibited High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors Eligibility : Trade & general public
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer JIEP
Tel : +81-3-5310-2020
E-mail : info@jiep.or.jp
Message from organizer Held with concurrent exhibitions.
The representative office, person or agency in Japan JTB Communication Design, Inc.
Tel : +81-3-5657-0767
E-mail : jpcashow@jtbcom.co.jp
Industry
Frequency Annual
last fair information 2022 year
Total number of visitors : 27972
Total number of exhibitors : 313
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update December 27, 2022

Japanese

Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.