Online Trade Fair Database (J-messe)
23nd IC & SENSOR PACKAGING TECHNOLOGY EXPO
| Date | January 19, 2022 - January 21, 2022 |
|---|---|
| City / Country |
Tokyo
/
Japan
/
Asia
|
| Venue |
Tokyo Big Sight, Japan |
| Items to be exhibited | assembly equipment, packaging materials/components, analysis/simulation software for IC packaging, semiconductor device, inspection equipment, SATS/contract design services, plating/etching materials/equipment, MEMS device, manufacturing equipment, etc. |
| For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online / Others : JPY 5,000 will be charged without a ticket. For details, please contact the organizer directly. |
| Organizer |
RX Japan Ltd.
Tel : +81-3-3349-8502 E-mail : isp@reedexpo.co.jp |
| Message from organizer | IC&SENSOR PACKAGING TECHNOLOGY EXPO is Asia's leading exhibition for IC final manufacturing gathering advanced equipment, materials and services. |
| Industry | |
| Frequency | Annual |
| last fair information |
2021 year Total number of visitors : 14806 The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | July 30, 2021 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
