IC Packaging Fair 2025

Date October 28, 2025 - October 30, 2025
Location Shenzhen / China / Asia
Venue Shenzhen World Exhibition & Convention Center (Baoan)
Items to be exhibited 1. Semiconductor Packaging equipment: - Die Bonder/Mounting Machine - Wire Bonding Machine - Formic Acid Reflow Oven- Sintering Furnace - Aluminum/Copper Wire Bonding Machine - Dispensing Equipment/Potting Machine - Plastic Encapsulation Machine / Molding Machine - Pin Insertion Machine - Ultrasonic Scanning/Inspection - Eutectic Bonding Machine - Flip Chip Mounting Machine / Flip Chip Bonder - Etching Machine - Photolithography Machine / Lithography Machine - Exposure and Development Machine 2. Peripheral Equipment\Test Equipment\Materials Wafer Thinning and Dicing Machine Tape and Reel Equipment / Tape and Reel Assembler Triple-Light AOI (Automated Optical Inspection) Functional Test Equipment Plating Equipment Ball Mounting Machine for Packaging Trim and Form Machine Push-Pull Tester Silver Paste Thermal Components Ceramic Substrate Aluminum Wire / Copper Wire / Gold Wire Cleaning Agent / Cleanser Photoresist
For Visitors Eligibility : Trade only
Method of admission : Free / Apply/register online
For details, please contact the organizer directly.
Organizer RX Greater China
Address : 42F, Intercontinental Center, 100 Yutong Road, Jingan District,Shanghai 200070, P.R.China
Person : Walden Li
Tel : +86-136-5125-1335
E-mail : walden.li@rxglobal.com
Message from organizer Held with concurrent exhibitions.
Industry
Frequency Annual
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update January 17, 2025

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