Online Trade Fair Database (J-messe)
IC Packaging Fair 2025
| Date | October 28, 2025 - October 30, 2025 |
|---|---|
| Location |
Shenzhen
/
China
/
Asia
|
| Venue |
Shenzhen World Exhibition & Convention Center (Baoan) |
| Items to be exhibited | 1. Semiconductor Packaging equipment: - Die Bonder/Mounting Machine - Wire Bonding Machine - Formic Acid Reflow Oven- Sintering Furnace - Aluminum/Copper Wire Bonding Machine - Dispensing Equipment/Potting Machine - Plastic Encapsulation Machine / Molding Machine - Pin Insertion Machine - Ultrasonic Scanning/Inspection - Eutectic Bonding Machine - Flip Chip Mounting Machine / Flip Chip Bonder - Etching Machine - Photolithography Machine / Lithography Machine - Exposure and Development Machine 2. Peripheral Equipment\Test Equipment\Materials Wafer Thinning and Dicing Machine Tape and Reel Equipment / Tape and Reel Assembler Triple-Light AOI (Automated Optical Inspection) Functional Test Equipment Plating Equipment Ball Mounting Machine for Packaging Trim and Form Machine Push-Pull Tester Silver Paste Thermal Components Ceramic Substrate Aluminum Wire / Copper Wire / Gold Wire Cleaning Agent / Cleanser Photoresist |
| For Visitors |
Eligibility : Trade only
Method of admission : Free / Apply/register online For details, please contact the organizer directly. |
| Organizer |
RX Greater China
Address : 42F, Intercontinental Center, 100 Yutong Road, Jingan District,Shanghai 200070, P.R.China Person : Walden Li Tel : +86-136-5125-1335 E-mail : walden.li@rxglobal.com |
| Message from organizer | Held with concurrent exhibitions. |
| Industry |
|
| Frequency | Annual |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | January 17, 2025 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
