Japanese Government Procurement
National University Corporation - Notice of Procurement (Goods & Services)CMOS-Silicon Based Wafer for Fabrication of Simple TEG and High-speed MRAM Test Chip 1 set
This procurement is covered by the WTO Agreement on Government Procurement, Japan-EU Economic Partnership Agreement or Japan-UK Comprehensive Economic Partnership Agreement.
| Publishing date | Aug 06, 2026 |
|---|---|
| Type of notice | Notice of Procurement (Goods & Services) |
| Procurement entity | National University Corporation - Miyagi |
| Classification |
0026 Miscellaneous Articles |
| Summay of notice | ⑴ The same as the notice above No.30. ⑵ Classification of the products to be procured : 26 ⑶ Nature and quantity of the products to be purchased : CMOS-Silicon Based Wafer for Fabrication of Simple TEG and High-speed MRAM Test Chip 1 set ⑷ Delivery period : By 3 December, 2026 ⑸ Delivery place : Center for Innovative Integrated Electronic Systems, Tohoku University ⑹ Qualifications for participating in the tendering procedures : Suppliers eligible for participating in the proposed tender are those who shall : A The same as the notice above No.30. B have the Grade A, Grade B or Grade C qualification during fiscal 2026 in the Tohoku area in manufacture for participating in tenders by Single qualification for every ministry and agency, or in tenders by Tohoku University, C The same as the notice above No.30. D The same as the notice above No.30. ⑺ Deadline for submission of documents : 17 : 00 1 September, 2026 ⑻ The same as the notice above No.30. ⑼ The same as the notice above No.30. |
