ASPS 2026 - Advanced Semiconductor Packaging & Chiplet Show

Date August 26, 2026 - August 28, 2026
Location Suwon / Korea / Asia
Venue Suwon Convention Center
Items to be exhibited Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials, Parts & Thermal Management Solutions, Semiconductor Packaging Technical Solutions & EDA Software, Semiconductor Glass Substrates & Processing Materials, Wafer Processing Materials, Parts & Equipment
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer Gyeonggi-do, Suwon City
Department : J. Expo Ltd.
Tel : +82-2-6285-9131
E-mail : semipkgshow@jexpo.or.kr
Message from organizer With the recent global semiconductor chip shortage, the demand for semiconductor packaging technology is continuing to rise. As South Korea's semiconductor industry ranks 2nd in the global market, we are proud to present to you Advanced Semiconductor Packaging & Chiplet Show, a B2B event to showcase the latest semiconductor packaging processing technology to the electronics, semiconductor, and automotive electronics manufacturers. Key Exhibitors : SAMSUNG, SK HYNIX, ASMPT, PEMTRON, PROTEC, SJ INNOTECH, MIRTEC, etc. Key Visitors : SAMSUNG, SK HYNIX, AMKOR TECHNOLOGY, HANA MICRON, JCET STATSCHIPPACK, NEPES, DOOSAN TESNA, etc.
Industry
Frequency Annual
last fair information 2025 year
Total number of visitors : 10754
Total number of exhibitors : 183
Data Certified : AKEI
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update February 26, 2026

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