Online Trade Fair Database (J-messe)
OSAT Solution Show 2026
| Date | June 10, 2026 - June 12, 2026 |
|---|---|
| Location |
Tokyo
/
Japan
/
Asia
|
| Venue |
Tokyo Big Sight |
| Items to be exhibited | General technologies, materials, and equipment related to semiconductor post-processing (packaging materials, assembly equipment, wafer-level packaging, fan-out packaging (FO-WLP, FO-PLP), 3D/2.5D packaging, PLP, test systems, handling equipment, package design tools, simulators, etc.) |
| For Visitors |
Eligibility : Trade & general public
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer | Japan Electronics Packaging and Circuits Association |
| Message from organizer | Held with concurrent exhibitions. |
| The representative office, person or agency in Japan |
Tel : +81-3-6675-6809 E-mail : jpca@shoei-bijutsu.co.jp |
| Industry |
|
| Frequency | Annual |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | December 26, 2025 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
