Online Trade Fair Database (J-messe)
2026 Microelectronics Show
| Date | June 10, 2026 - June 12, 2026 |
|---|---|
| Location |
Tokyo
/
Japan
/
Asia
|
| Venue |
Tokyo Big Sight |
| Items to be exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
| For Visitors |
Eligibility : Trade & general public
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer | JIEP |
| Message from organizer | Held with concurrent exhibitions. |
| The representative office, person or agency in Japan |
Tel : +81-3-6675-6809 E-mail : jpca@shoei-bijutsu.co.jp |
| Industry |
|
| Frequency | Annual |
| last fair information |
2025 year Total number of visitors : 49760 Total number of exhibitors : 442 The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | December 26, 2025 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
