Online Trade Fair Database (J-messe)
SEMISOL 2026
| Date | June 10, 2026 - June 12, 2026 |
|---|---|
| Location |
Tokyo
/
Japan
/
Asia
|
| Venue |
Tokyo Big Sight
Expected floor size ：1,080 sq.m.
|
| Items to be exhibited | Materials, components, and manufacturing equipment technology for semiconductor post-processing, semiconductor manufacturing technology, chiplets (2.5D/3D packaging), advanced chiplet technology, semiconductor post-processing technologies, TSV (through-silicon via) and RDL (redistribution layer), packaging technology, materials, and components, heterogeneous bonding, sealing materials, resists, other materials and components, package substrates (printed circuit boards, tape substrates, ceramic substrates), package analysis and simulation software, grinding, dicing, die bonding, wire bonding, molding technologies, materials, equipment, and products, analytical equipment, inspection equipment, universities and research institutes |
| For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
JTB Communication Design Inc.
E-mail : smartsensing@jtbcom.co.jp Inquiry Form : https://jcd-event.smktg.jp/public/application/add/2911 |
| Message from organizer |
Semiconductor back-end processing technology is becoming increasingly diverse as an important area for realizing higher performance, smaller size, lower power consumption, and improved reliability of devices while responding to evolving market needs. In recent years, 3D packaging technology, chiplet technology, and the use of advanced materials have attracted attention, opening up new possibilities that go beyond conventional technologies. Against this background, we have launched a new exhibition, "SEMISOL - Semiconductor Post-Processing Technology & Solutions Expo," focusing on adding high added-value to post-processing that supports the evolution of the semiconductor industry. This exhibition will provide a forum for promoting the development of the industry with the theme of markets and innovative technologies and solutions that support the next generation, such as AI, 5G, IoT, and automotive applications.
Held with a concurrent exhibition. |
| Industry | |
| Frequency | Annual |
| last fair information |
2025 year Total number of visitors : 5270 Total number of exhibitors : 15 The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | December 26, 2025 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
