NEPCON China 2026

Date April 21, 2026 - April 23, 2026
Location Shanghai / China / Asia
Venue Shanghai World Expo Exhibition & Convention Center
Expected floor size ：45,000 sq.m.
Items to be exhibited Electronics Components, Soldering Equipment, Electronic Materials & Anti-static, System Integration for End-product Assembly, Machine Vision & Sensing Technology, EMS, OSAT, Test & Measurement Equipment, Transmission Equipment & Pneumatic Elements, Industrial Automatic Information Technology & Control Software, Semiconductor Packaging Test Equipment, Mount Technology, Dispensing & Coating Equipment, Industrial Robots, Motion Control Equipment, IC Designer, Semiconductor Material
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer RX
Tel : +86-21-2231-7010
E-mail : Julia.gu@rxglobal.com
Message from organizer Held with a concurrent exhibition.
The representative office, person or agency in Japan <Japanese Exhibitor Contact> RX Japan Ltd.
Department : ISG
Tel : +81-80-2063-5148
E-mail : sayo.hirano@rxglobal.com
Industry
Frequency Annual
last fair information 2024 year
Total number of visitors : 32563
Expected floor size : 42,000 sq.m.
Data Certified : UFI
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update May 12, 2025

Japanese

A modal window will open.
A modal window will open.
A modal window will open.

Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.