Online Trade Fair Database (J-messe)
2025 Microelectronics Show
Date | June 4, 2025 - June 6, 2025 |
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Location |
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Venue |
Tokyo Big Sight |
Items to be exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
For Visitors |
Eligibility : Trade & general public
Method of admission : Apply/register online For details, please contact the organizer directly. |
Organizer | JIEP |
Message from organizer | Held with concurrent exhibitions. |
The representative office, person or agency in Japan |
Tel : +81-3-5931-0039 E-mail : jpcashow@jcs-c.com |
Industry |
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Frequency | Annual |
last fair information |
2024 year Total number of visitors : 48334 Total number of exhibitors : 438 The past records may include concurrent/joint exhibits. |
Official website |
For more detailed information of the trade fair, please check the official website
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last update | December 25, 2024 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.