ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show

Date August 28, 2024 - August 30, 2024
City / Country Suwon / Korea / Asia
Venue Suwon Convention Center
Expected floor size :7,877 sq.m.
Items to be exhibited Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer Suwon Convention Center, J.EXPO LTD. The Electronic Times
Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
Person : Sharon Huh
Tel : +82-31-303-6052
E-mail :
Message from organizer With the recent global semiconductor chip shortage, the demand for semiconductor packaging technology is continuing to rise. As South Korea's semiconductor industry ranks 2nd in the global market, we are proud to present to you Advanced Semiconductor Packaging & Chiplet Show, a B2B event to showcase the latest semiconductor packaging processing technology to the electronics, semiconductor, and automotive electronics manufacturers. Key Exhibitors : SAMSUNG, SK HYNIX, ASMPT, PEMTRON, PROTEC, SJ INNOTECH, MIRTEC, etc. Key Visitors : SAMSUNG, SK HYNIX, AMKOR TECHNOLOGY, HANA MICRON, JCET STATSCHIPPACK, NEPES, DOOSAN TESNA, etc.
Frequency Annual
last fair information 2023 year
Total number of visitors : 8296
Total number of exhibitors : 91
Data Certified : AKEI
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update May 10, 2024


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