8th Adhesion & Bonding Expo TOKYO

Date October 29, 2024 - October 31, 2024
City / Country Chiba (Chiba) / Japan / Asia
Venue Makuhari Messe
Items to be exhibited Adhesive/adhesive materials, bonding equipment/technology, inspection/measurement/analysis technology, related equipment, design simulation tools, etc.
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer RX Japan Ltd.
Tel : +81-3-6739-4118
E-mail : mw-j.jp@rxglobal.com
Message from organizer Multi-materialisation has become an indispensable technology in the automotive and electronics fields. As a specialised exhibition dealing with a wide range of adhesion and bonding technologies, from the most advanced dissimilar material bonding technologies to general applications, this exibhition attracts experts from a variety of industries.
Held with concurrent exhibitions.
Industry
Frequency Annual
last fair information 2023 year
Total number of visitors : 43663
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update October 16, 2023

Japanese

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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.