DIMEX-2023 International Die & Mould Exhibition

Date October 27, 2023 - October 29, 2023
City / Country Bangalore / India / Asia
Venue KTPO Convention Center, Bangalore
Expected floor size :10,000 sq.m.
Items to be exhibited Additive Manufacturing,3D Printing, CNC Milling Machining Centre, Cutting Tools, Heat Treatment, Hot Runner System, Injection Moulding Machine, Inspection and Quality Systems, CMM Machine Tools and Accessories for Dies and Moulds Machines for Plastics & Accessories, Mechanical Presses for Sheet Metal Components, Precision Machining/ Aerospace Components, Raw Material Suppliers (Steel),Texturizing, Polishing & Plating Software, CAD/CAM/CAE, Simulation Suppliers, Standard parts of Dies and Moulds, consumables, Electrode, Graphite, Copper wire, Grinding Polishing, Welding, Mould base, Component Surface Treatment, Die Casting Dies & Rubber Moulds Tool, Jig, Fixture and Gauges Tool Room - Plastic Injection Moulds / Moulded Components, Sheet Metal Dies, Sheet Metal Components
For Visitors Eligibility : Trade only
Method of admission : Free / Apply/register online / Registration/tickets available at event
For details, please contact the organizer directly.
Organizer Maxx Business Media Pvt. Ltd.,
Address : T9, 3rd Floor, Swastik Manandi Arcade, Seshadripuram, Bangalore
Department : Director
Person : Eshwasri S
Tel : +919742711211
E-mail : info@diemex.in
Inquiry Form : https://www.diemex.in/contact
Frequency Once in 2 years
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update March 13, 2023
A modal window will open.
A modal window will open.
A modal window will open.

Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.