NEPCON China 2023 (Shanghai)

Date July 19, 2023 - July 21, 2023
Location Shanghai / China / Asia
Venue Shanghai World Expo Exhibition & Convention Center
Expected floor size ：32,500 sq.m.
Items to be exhibited Board handler conveyor systems & accessories, Chip carriers, Component feeding systems, Curing systems, De-soldering systems, Encapsulation equipment, Ovens & furnaces, PCB assembly, PCB fabrication, Pick & place systems, Screen printers & accessories, Vision placement machines
For Visitors Eligibility : Trade only
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer RX
Tel : +86-21-2231-7010
E-mail : Julia.gu@rxglobal.com
The representative office, person or agency in Japan <Japanese Exhibitor Contact> RX Japan Ltd.
Department : ISG
Tel : +81-80-2063-5148
E-mail : sayo.hirano@rxglobal.com
Industry
Frequency Annual
last fair information 2018 year
Total number of visitors : 26894
Total number of exhibitors : 500
Expected floor size : 32,500 sq.m.
Data Certified : UFI
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update March 29, 2023

Japanese

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