[RFP] JETRO X-HUB OUTBOUND PROGRAM
May 11, 2023
GENERAL INFORMATION
1. Subject: JETRO X-HUB OUTBOUND PROGRAM
2. Term of contract: the contract start date to Dec 31, 2023
3. Closing date for Application: 17:00 (PDT) on May 24, 2023
4. Content of Contract: As indicated in Application Guidelines (Attachment 1)
INSTRUCTIONS TO APPLICANTS
1. Qualification Requirements
1) Prospective candidate(s) engaged in the project must satisfy the conditions stated in the Application Guidelines. (Attachment 1)
2) NOT under the circumstances of being denied participation due to unethical and/or unlawful activities by either JETRO or Ministry of Economy, Trade, and Industry (METI) from previous
procurement offerings.
2. Preparation of Application
1) Application shall be prepared on the Application Form included in this RFP. Applicants shall enter all requested information in the appropriate spaces on the Application Form (See attachment 1 and 2). No oral, telephone, or facsimile will be accepted. All costs of preparation shall be borne by the Applicants.
3. Delivery of Application
All Application forms (see below) shall be sent to the following e-mail address by 17:00 (PDT) on May 24th, 2023
Required to submit:
Business Proposal 1 Copy
Quotation for JETRO X-HUB OUTBOUND PROGRAM 1 Copy
Attn: Will Ferguson, John Bui
E-mail: will_ferguson@jetro.go.jp, sfcadmin@jetro.go.jp
4. Language of Application:
English
5. Evaluation of Application:
1st evaluation
Screening of Application documents by JETRO San Francisco
2nd evaluation
Presentation at JETRO San Francisco, or virtually. Interviews will be conducted from May 25, 2023.
(The detailed schedule for the presentation will be notified to the companies who pass the 1st evaluation)
6. Announcement of Tender
Tender will be announced to bidders by email. Given the nature of the bidding process, JETRO will refrain from providing feedback on the results.
7. Contact
Attn: Will Ferguson, John Bui
E-mail: will_ferguson@jetro.go.jp, sfcadmin@jetro.go.jp
Application Related Documents:
Attachment 1: Application Guidelines <PDF>
Attachment 2: Proposal Form <Word>