[RFP] Market Validation Project in Silicon Valley

Sep 17, 2021

GENERAL INFORMATION

  1. Subject: JETRO Market Validation Project in Silicon Valley
  2. Term of contract: the contract start date to March 25, 2022
  3. Closing date for Application: 17:00 (PDT) on September 30, 2021.
  4. Content of Contract: As indicated in Application Guidelines (Attachment 1)

INSTRUCTIONS TO APPLICANTS

  1. Qualification Requirements
    1) Prospective candidate(s) engaged in the project must satisfy conditions stated in the Application Guidelines. (Attachment 1)
    2) NOT under the circumstances of being denied participation due to unethical and/or unlawful activities by either JETRO or Ministry of Economy, Trade, and Industry (METI) from previous procurement offerings.

  2. Preparation of Application
    1) Application shall be prepared on the Application Form included in this RFP. Applicants shall enter all requested information in the appropriate spaces on the Application Form. (See attachment 2 and 3)
    No oral, telephone, or facsimile will be accepted. All costs of preparation shall be borne by the Applicants.

  3. Delivery of Application
    All Application forms (see below) shall be sent to the following e-mail address by 17:00 (PDT) on September 30, 2021.

          Required to submit:

          Business Proposal 1 Copy

          Quotation for JETRO Market Validation Project in Silicon Valley 1 Copy

          AttnMr. Will Ferguson

          E-mail: will_ferguson@jetro.go.jp

  1. Language of Application: English
  1. Evaluation of Application:
    1st evaluation
    Screening of Application documents by JETRO San Francisco

    2nd evaluation
    Presentation at JETRO San Francisco, or virtually.
    (The detailed schedule for the presentation will be notified to the companies who pass the 1st evaluation)
  1. Announcement of Tender
    Tender will be announced to bidders by email. Given the nature of the bidding process, JETRO will refrain from providing feedback on the results.
  1. Contact
    AttnMr. Will Ferguson
    E-mail: will_ferguson@jetro.go.jp

  2. Attachments
    Attachment 1: Specification <Word>     
    Attachment 2: Proposal Form <Word>  
    Attachment 3: Estimate Form <Excel>