Online Trade Fair Database (J-messe)
6th ADHESION & JOINING EXPO OSAKA
Date | May 11, 2022 - May 13, 2022 |
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City / Country | Osaka (Osaka) / Japan / Asia |
Venue |
INTEX Osaka |
Items to be exhibited | Adhesive Materials, Joining Equipment & Technologies, Testing/Measurement/Analysis, Related Equipment, Design Simulation Tools, etc. |
For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online / Others : Admission fee: JPY 5,000/person without invitation ticket. For details, please contact the organizer directly. |
Organizer |
RX Japan Ltd.
Tel : +81-3-3349-8568 E-mail : mw-j@reedexpo.co.jp |
Industry |
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Frequency | Annual |
Official website | For more detailed information of the trade fair, please check the official website of the individual organizer. |
last update | December 27, 2021 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.