2021 Microelectronics Show

Date May 26, 2021 - May 28, 2021
City / Country Tokyo / Japan / Asia
Venue Tokyo Big Sight
Items to be exhibited High-density and high-frequency packaging technology applied products, high-density substrates and interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP) / system-on-chip (SoC), display and optical devices centered on the most advanced technologies of the future / Sensors, high-density mounting-related materials, various pastes, lead-free solders / bonding materials, sealing resins, adhesives, underfill materials, heat-resistant materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD / COG Bonder, etc.) & Dispenser & Flip Chip (FC) Mounting & BGA / CSP Assembly & TAB Mounting & OLB / ILB System & COB System Various High Density Mounting Related Systems & Equipment, Production Equipment, Related Books etc.
For Visitors Eligibility : Trade & general public
Method of admission : Apply/register online
For details, please contact the organizer directly.
Organizer JIEP
Tel : +81-3-5310-2020
E-mail : info@jiep.or.jp
Message from organizer Held with concurrent exhibitions.
Frequency Annual
last fair information 2019 year
Total number of visitors : 44110
Total number of exhibitors : 507
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update October 16, 2020

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