Online Trade Fair Database (J-messe)
|Date||May 26, 2021 - May 28, 2021|
|City / Country||Tokyo / Japan / Asia|
Tokyo Big Sight
|Items to be exhibited||High-density and high-frequency packaging technology applied products, high-density substrates and interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP) / system-on-chip (SoC), display and optical devices centered on the most advanced technologies of the future / Sensors, high-density mounting-related materials, various pastes, lead-free solders / bonding materials, sealing resins, adhesives, underfill materials, heat-resistant materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD / COG Bonder, etc.) & Dispenser & Flip Chip (FC) Mounting & BGA / CSP Assembly & TAB Mounting & OLB / ILB System & COB System Various High Density Mounting Related Systems & Equipment, Production Equipment, Related Books etc.|
Eligibility : Trade & general public
Method of admission : Apply/register online
For details, please contact the organizer directly.
Tel : +81-3-5310-2020
E-mail : info＠jiep.or.jp
|Message from organizer||Held with concurrent exhibitions.|
|last fair information||
Total number of visitors : 44110
Total number of exhibitors : 507
The past records may include concurrent/joint exhibits.
|Official website||For more detailed information of the trade fair, please check the official website of the individual organizer.|
|last update||October 16, 2020|
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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.