Online Trade Fair Database (J-messe)
|Date||January 20, 2021 - January 22, 2021|
|City / Country||Tokyo / Japan / Asia|
Tokyo Big Sight, Japan
|Items to be exhibited||assembly equipment, packaging materials/components, analysis/simulation software for IC packaging, semiconductor device, inspection equipment, SATS/contract design services, plating/etching materials/equipment, MEMS device, manufacturing equipment, etc.|
Eligibility : Trade only
Method of admission : Apply/register online / Others : JPY 5,000 will be charged without a ticket.
For details, please contact the organizer directly.
Reed Exhibitions Japan Ltd.
Tel : +81-3-3349-8502
E-mail : email@example.com
|Message from organizer||IC&SENSOR PACKAGING TECHNOLOGY EXPO is Asia's leading exhibition for IC final manufacturing gathering advanced equipment, materials and services.|
|Official website||For more detailed information of the trade fair, please check the official website of the individual organizer.|
|last update||June 18, 2020|
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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.