1. Site Top
  2. Business Opportunities
  3. Online Trade Fair Databese (J-messe)
  4. 22nd IC & SENSOR PACKAGING TECHNOLOGY EXPO

22nd IC & SENSOR PACKAGING TECHNOLOGY EXPO

Date January 20, 2021 - January 22, 2021
City / Country Tokyo / Japan / Asia
Venue Tokyo Big Sight, Japan
Items to be exhibited assembly equipment, packaging materials/components, analysis/simulation software for IC packaging, semiconductor device, inspection equipment, SATS/contract design services, plating/etching materials/equipment, MEMS device, manufacturing equipment, etc.
For Visitors Eligibility : Trade only
Method of admission : Apply/register online / Others : JPY 5,000 will be charged without a ticket.
For details, please contact the organizer directly.
Organizer Reed Exhibitions Japan Ltd.
Tel : +81-3-3349-8502
E-mail : isp@reedexpo.co.jp
Message from organizer IC&SENSOR PACKAGING TECHNOLOGY EXPO is Asia's leading exhibition for IC final manufacturing gathering advanced equipment, materials and services.
Industry
Frequency Annual
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update June 18, 2020

Please choose one of the following feedbacks for an improvement in quality of JETRO's "J-messe".

Thank you for your cooperation.

Please choose the degree of usefulness.

Failed register the evaluation.

It is an article that has already been evaluated.

It can not be evaluated.

invalid access.

Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.