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  4. 22nd Design Engineering & Manufacturing Solutions Expo Osaka

22nd Design Engineering & Manufacturing Solutions Expo Osaka

Date October 2, 2019 - October 4, 2019
City / Country Osaka (Osaka) / Japan / Asia
Venue INTEX OSAKA
Items to be exhibited CAD/CAM, 3D digitizer, plotter/printer/scanner, structural analysis software, FEA, thermal & fluid analysis software, CAE outsourcing service, e-PDM (web-applied PDM), CPC(collaborative product commerce), components management system, document management system, etc.
For Visitors Eligibility : Trade only
Method of admission : Apply/register online / Others : Admission fee: JPY 5,000/person without invitation ticket.
For details, please contact the organizer directly.
Organizer Reed Exhibitions Japan Ltd.
Tel : +81-3-3349-8506
E-mail : dms-kansai@reedexpo.co.jp
Message from organizer DMS Osaka is Western Japan's largest exhibition gathering all kinds of IT solutions such as CAD, CAE, ERP, production systems. DMS Osaka attracts a significant number of professionals from design, development, production engineering, and information systems departments, who are looking to buy solutions for their businesses.
Held with concurrent exhibitions.
Industry
Frequency Annual
last fair information 2018 year
Total number of visitors : 38673 (including : 590 foreign visitors)
Total number of exhibitors : 1233 (including : 230 foreign exhibitors)
Expected floor size : 20,581 sq.m.
Data Certified : JECC(Japan Exhibition Certification Council)
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update May 29, 2019

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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.