Date January 15, 2020 - January 17, 2020
City / Country Tokyo / Japan / Asia
Venue Tokyo Big Sight
Items to be exhibited -Mounters/Testing Equipment<br/>-Technologies for IC & Sensor Packaging<br/>-Electronic Components/Materials<br/>-Printed Wiring Boards<br/>-Fine Process Technologies<br/>-LED & Laser Diode Technologies
For Visitors Eligibility : Trade only
Method of admission : Apply/register online / Others : Admission fee: JPY 5,000/person without invitation ticket.
For details, please contact the organizer directly.
Organizer Reed Exhibitions Japan Ltd.
Tel : +81-3-3349-8502
E-mail : inj@reedexpo.co.jp
Message from organizer NEPCON JAPAN consists of 7 specialised exhibitions<br/>- 34th INTERNEPCON JAPAN<br/>- 34th ELECTROTEST JAPAN<br/>- 21st IC & Sensor Packaging Technology Expo<br/>- 21st ELECTRONIC COMPONENTS & MATERIALS EXPO<br/>- PWB EXPO-21st Printed Wiring Boards Expo<br/>- 10th FINE PROCESS TECHNOLOGY EXPO<br/>- 12th LED & Laser Diode Technoolgy EXPO
Frequency Annual
last fair information 2019 year
Total number of visitors : 64508
Total number of exhibitors : 1895
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update May 21, 2019

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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
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