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  4. 3rd JOINING OSAKA - Adhesion & Joining Expo Osaka

3rd JOINING OSAKA - Adhesion & Joining Expo Osaka

Date May 22, 2019 - May 24, 2019
City / Country Osaka (Osaka) / Japan / Asia
Venue INTEX Osaka
Items to be exhibited Adhesive Materials, Joining Equipment & Technologies, Testing/Measurement/Analysis, Related Equipment, Design Simulation Tools, etc.
For Visitors Eligibility : Trade only
Method of admission : Apply/register online / Others : Admission fee: JPY 5,000/person without invitation ticket.
For details, please contact the organizer directly.
Organizer Reed Exhibitions Japan Ltd.
Tel : +81-3-3349-8568
E-mail : joining@reedexpo.co.jp
Message from organizer The show gathers all kinds of advanced adhesives and joining technologies for automobile, electronics, construction, etc. Held with concurrent exhibitions.
Industry
Frequency Annual
last fair information 2018 year
Total number of visitors : 24864
Total number of exhibitors : 308 (including : 32 foreign exhibitors)
Data Certified : JECC(Japan Exhibition Certification Council)
The past records may include concurrent/joint exhibits.
Official website For more detailed information of the trade fair, please check the official website External site: a new window will open. of the individual organizer.
last update May 7, 2019

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Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.