Online Trade Fair Database (J-messe)
ITM Poland - Innovations-Technologies-Machines
| Date | June 4, 2019 - June 7, 2019 |
|---|---|
| City / Country |
Poznan
/
Poland
/
Europe・CIS
|
| Venue |
Poznan Congress Center |
| Items to be exhibited | Machine tools, metal industry, industrial manipulators and robots, device and materials for rapid technologies, technological equipment, hydraulics, pneumatics, drives, welding, stainless steel, metallurgy, foundry, metal industry, surface processing technologies, automation for the industry, software, CAD / CAM systems, railway transport, science for industry. With 3D Solutions |
| For Visitors |
Eligibility : Trade only
Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
Poznan International Fair Ltd.
Tel : +48-61-869-21-16 E-mail : itm@grupamtp.pl |
| Message from organizer |
ITM Poland is an international trade fair that brings together specialists of the manufacturing industry to showcase their latest innovations, technologies and machines. The 2019 will focus on Industry 4.0 in Poznan, Poland.
Held with concurrent exhibitions. |
| The representative office, person or agency in Japan |
AsianLustre Co., Ltd. Tel : +81-52-835-5550 E-mail : event@asianlustre.co.jp |
| Industry |
|
| Frequency | Once in 2 years |
| last fair information |
2017 year Total number of visitors : 14777 Total number of exhibitors : 758 Expected floor size : 25,000 sq.m. The past records may include concurrent/joint exhibits. |
| Official website |
For more detailed information of the trade fair, please check the official website
of the individual organizer.
|
| last update | February 22, 2019 |
Information contained herein are subject to amendment, postponement and cancellation by the organizer at any time without notice.
For more detailed information on each event, please check the official website of its organizer. JETRO shall not be responsible for any loss or inconvenience caused by actions taken based the information within J-messe.
