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Online Trade Fair Database (J-messe)

Japan

List of Upcoming Trade Fairs and Exhibitions

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Results 1-20 of 469

16-Jan-2017 to 17-Jan-2017

Tokyo / Japan / Asia

Local specialty products (confectionery, food, liquor, beverage, craft, general merchandise, equipment, parts, etc.)

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Mounters, SMT Equipment, Testing Devices, IC Packaging Technologies, PCB/PWB, Electronic Components, Advanced Materials, Processing Technologies, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Mounters, Cream Solder Printers, Dispensers, Carrier Tapes, Parts Feeders, Marking System/Ink, ERP/SCM, Punching/Pressing Machines, Sealing Machines,
Washing Machines, Electromechanical Parts, Various Tools/Software, Rework/ Repairing Machines, Masks, Carrier Tape Forming Equipment, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Board Vision Inspection Equipment, Solder Vision Inspection Equipment, Rework/repair Equipment, Tester, Inspection related components, Measurement/Test/Analysis Equipment, Contract Analysis Services, other Testers, Inspection, Measurement Equipment and Devices, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Wire Bonders, Die Bonders, FC Bonders, Other Various Bonders, Molding Machines, Resin Coating Machines, Dicing Machines, Lead Processing Machines, Laser Processors, Other Equipment for IC Packaging, Packaging Materials/Components, ACF/NCF, ACP/NCP, Die Adhesives, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Press Work, Cutting, Drilling, Fine/Precision, Sheet-metal Processing, Fine Casting, Metal Molding, Electroforming, Fine Bonding, Etching, Coating, Polishing, Mirror Grinding, Deburring, Plating, Laser Processing, Difficult-to-cut Materials Processing, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

PWBs/PCBs, PCB Materials, Design/Development Tools from Functional Design Tools to Simulation Tools and CAD/CAM, ODM/ Design Services and Contract Development Services, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Condenser/Capacitor, Resistor, Filter, Relay, Motor, Connector & Cable, Other Component & Device, Inductor/Coil, Transformer, Crystal Devices, Fuse, IC, Thermal Design/Noise Reduction Components, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Drive System, Rechargeable Batteries, Next-generation Batteries, Motor Technologies, Inverters, Peripherals, Chargers, Connectors, Harnesses, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Apps, systems & products for connected cars.
Driving/Vehicle Management, Map/Access/Weather Information, Entertainment, Environmentally Friendly Driving System, Safety System, Security System, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Trial pieces for following automotive components, Processing technologies for automotive components; Press work, Sheet-metal work, Casting/Forging, Surface finishing/Heat treatment, Cutting/Grinding process, Resin fabrication, etc.

18-Jan-2017 to 19-Jan-2017

Kobe (Hyogo) / Japan / Asia

New collections of chemical shoes.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Car Electronics Technology
EV/HEV Technology
Connected car technology
Lightweight technology
Components processing technology
FA, IoT and energy saving systems etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

In-vehicle Embedded Software, Semiconductors, Electronic Components & Devices, Testing Technologies, Automotive Components & In-vehicle System, Electronic Materials, Manufacturing Equipments/Technologies, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Materials
Molding / Processing Technologies, Processing Equipment
Components / Modules
Dissimilar Material Joining Technology
Other Technologies for Automotive Weight Reduction

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Trial pieces for following automotive components, Processing technologies for automotive components; Press work, Sheet-metal work, Casting/Forging, Surface finishing/Heat treatment, Cutting/Grinding process, Resin fabrication, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Components for LED Packaging, Components for OLED, Device, Optical Component,
Power Supply & IC, Thermal Solution Technology, Processing Technology,
Simulation/Inspection/Measurement/Test/Evaluation Equipment.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Smartwatch, smart glasses, smart devices(ring, necklace, fabric), electronic components/material, Battery, Display, Sensor, IoT/M2M solutions, Cloud Services, Location-based services(LBS), Apps/Content for AR, Development Tool for AR, AR services, VR systems, Head mounted display, etc.

18-Jan-2017 to 20-Jan-2017

Tokyo / Japan / Asia

Robot
-Industrial robot
-Service robot etc.
Intelligence/Control Technology
-AI -Embedded system
-IoT solution etc.
Drive Technology
-Motor
-Actuator etc.
Sensing Technology
-Sensor
-Measurement/Control/Testing device etc.

20-Jan-2017 to 22-Jan-2017

Yokohama (Kanagawa) / Japan / Asia

A whole range of fishing tackles and goods for outdoor leisure.

Refine the Search

City

Sapporo (Hokkaido) (1)
Sendai (Miyagi) (1)
Tokorozawa (Saitama) (0)
Chiba (Chiba) (42)
Tokyo (283)
Yokohama (Kanagawa) (37)
Kawasaki (Kanagawa) (1)
Fujisawa (Kanagawa) (0)
Niigata (Niigata) (0)
Nagaoka (Niigata) (0)
Toyama (Toyama) (0)
Kanazawa (Ishikawa) (2)
Hamamatsu (Shizuoka) (0)
Nagoya (Aichi) (9)
Nagahama (Shiga) (1)
Osaka (Osaka) (71)
Toyonaka (Osaka) (0)
Kobe (Hyogo) (5)
Hiroshima (Hiroshima) (1)
Matsuyama (Ehime) (0)
Fukuoka (Fukuoka) (6)
Kitakyushu (Fukuoka) (3)
Kumamoto (Kumamoto) (0)

Industry

General Exhibition(1)
Fundamental Industries(90)
Agriculture, Forestry, Fishery and Food(78)
Building, Construction (56)
Machinery, Industrial Technology (246)
Information, Telecommunication (181)
Transportation, Logistics, Packaging (113)
Medical Care, Health (89)
Living(151)
Hobby, Education (72)
Services(108)
Environment(41)
Others(12)

Date

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Inquiries to Online Trade Fair Database J-messe

For further information of individual trade fairs in J-messe,please kindly contact the organizer directly.

For other questions or comments, please refer to the information below.

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